| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing die-bonding film excellent in balance in characteristics of retainability in dicing, peelability of a semiconductor chip and low staining property to a semiconductor wafer. <P>SOLUTION: The dicing die-bonding film includes: a dicing film having an adhesive layer provided on a base material; and a die-bonding film provided on the adhesive layer, in which the adhesive layer of the dicing film includes a laminated structure of a heat-expandable adhesive layer containing a foaming agent and an active energy ray-curable antifouling adhesive layer on the heat-expandable adhesive layer, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. As the foaming agent, heat-expandable micro-balls are preferable. <P>COPYRIGHT: (C)2010,JPO&INPIT |
