发明名称 MOUNTING CONDITION DECISION METHOD, MOUNTING CONDITION DECISION DEVICE, COMPONENT MOUNTING MACHINE, AND PROGRAM
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce a manufacturing time of a mounting substrate to increase the number of mounting substrates per unit time. <P>SOLUTION: A mounting condition decision device includes: a monitor 305a monitoring whether a mounting condition conforming to a current arrangement of components of a component mounting machine is set in the component mounting machine when the components are mounted to the substrate; a determination section 305c determining whether a mounting head can increase the number of components to which the mounting heads can simultaneously be adsorbed by changing the current arrangement of components when it is detected that the mounting condition conforming to the current arrangement of the components is not set in the component mounting machine; and a decision section 305d deciding the arrangement of components for increasing the number of components to which the mounting heads can simultaneously be adsorbed as the mounting condition when it is determined that the mounting head can increase the number of components to which the mounting heads can simultaneously be adsorbed. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010129889(A) 申请公布日期 2010.06.10
申请号 JP20080304988 申请日期 2008.11.28
申请人 PANASONIC CORP 发明人 KAWAGUCHI TEPPEI;KAWASE TAKEYUKI
分类号 H05K13/04 主分类号 H05K13/04
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