PLATING APPARATUS AND PLATING METHOD

摘要

<P>PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method in which the stain of a base body is efficiently removed while suppressing the warpage of the base body in plating. Ž<P>SOLUTION: The plating apparatus is equipped with a holding plate 12 for holding the base body on which a plating layer is formed, a plating liquid supply part 50 for supplying a plating liquid 22 to the base body 10 and a heating means 18 for heating a second surface 38 opposed to a first surface 36 of the base body 10 to be plated at a temperature higher than that of the plating liquid 22 to form the plating layer on the surface of the base body. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž