| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component package having high bonding strength to a printed board to mount. SOLUTION: This electronic component package is composed of a rectangular package body 5 capable of carrying electronic components, and a lid member 20 to airtightly seal the package body 5 containing electronic components. A pair of first mounting terminals 6, 7 are formed in one diagonal areas along the side facing the outside bottom face of the package body 5, and a pair of second mounting terminals 8, 9 are formed in the other diagonal areas along the side facing the outside bottom face of the package body 5 in this electronic component package 1. COPYRIGHT: (C)2010,JPO&INPIT
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