| 摘要 |
A wiring board includes a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer (resin layer) interposed therebetween, and the wiring layers are connected to each other through a via formed in each of the resin layers. A recessed portion is formed in an annular shape surrounding a chip mounting area on the outermost resin layer on a chip mounting surface side of the wiring board. Alternatively, a projected portion is formed instead of the recessed portion.
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