| 摘要 |
A method for manufacturing a semiconductor memory device, includes: forming a stacked unit above a semiconductor substrate, the stacked unit including a plurality of insulating layers alternately stacked with a plurality of electrode layers, the electrode layers being formed of a semiconductor; making a hole in the stacked unit to pass through the electrode layers and the insulating layers; forming an insulating film on a side wall of the hole, the insulating film including a charge storage layer; forming a semiconductor layer in an interior of the hole to align in a stacking direction of the electrode layers and the insulating layers to form a memory string by multiply connecting memory cells in the stacking direction, the memory cell including the electrode layer, the charge storage layer opposing the electrode layer, and the semiconductor layer opposing the charge storage layer; making a trench in a portion of the stacked unit proximal to the memory string to pass through the electrode layers and the insulating layers; forming a metal film on a side wall of the trench; forming a cap film to cover the metal film and fill into the trench; performing heat treatment in the state where the cap film is filled into the trench to cause the metal film to react with the semiconductor of the electrode layers and form a compound between the semiconductor and the metal film at portions of the electrode layers contacting the metal film; removing the cap film and an unreacted excess portion of the metal film; and providing a dielectric substance in the trench after the cap film and the unreacted excess portion are removed.
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