HEAT SINK DEVICE WITH A SHIELDING MEMBER

摘要

A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.