| 摘要 |
Methods for sputter depositing a transparent conductive layer are provided in the present invention. The transparent conductive layer may be utilized as a contact layer on a substrate or a back reflector in a photovoltaic device. In one embodiment, the method includes supplying a gas mixture into a processing chamber, sputtering source material from a target disposed in the processing chamber, wherein the target has dopants doped into a base material, wherein the dopants are selected from a group consisting of boron containing materials, titanium containing materials, tantalum containing materials, tungsten containing materials, alloys thereof, or combinations thereof, and reacting the sputtered material with the gas mixture to deposit a transparent conductive layer on a substrate disposed in the processing chamber. |
