SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve the safety and the shield property of the semiconductor package by electrically connecting a ground layer with a shield layer through a wiring pattern. CONSTITUTION: A plurality of first wiring patterns(111) is formed on the upper side of an insulating layer. A second wiring pattern is formed on the lower side of the insulating layer. A circuit board(110) includes a ground layer electrically connected with the first wiring pattern. A conductive bump electrically connected with the first wiring pattern is formed on a semiconductor die(120). An encapsulant(130) forms a trench exposing the first wiring pattern to the outside. A conformal shield(140) is formed with a constant thickness to cover the entire of the encapsulant.