| 摘要 |
PURPOSE: A camera module is provided to improve the reliability for falling-down by mounting a holder at a protrusion portion of an external portion on a substrate. CONSTITUTION: A WLO(Wafer Level Optic)(30) is produced as a wafer optical device, and an image sensor(20) converts an optical signal into an electric signal through the WLO. A holder(40) is a housing of a camera module, and a circuit pattern is formed on a substrate. The circuit pattern transfers the converted electric signal into a body, and a protrusion portion is formed at an outer portion.
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