SUCTION PAD FOR SEMICONDUCTOR PACKAGES

摘要

PURPOSE: A semiconductor package suction pad is provided to prevent the leakage of air in a process of vacuum-sucking the semiconductor package by being closely contacted with one side of the semiconductor package while vertically moving. CONSTITUTION: A body unit(11) is combined to the holder(2) of a picker for returning a semiconductor package(P). An sucking unit(12) is formed on the lower part of the body unit to be transferable. The suction unit sucks the semiconductor package by contacting with a side of the semiconductor package. A cut groove(15) is integrated to the body unit. A transform unit is inserted in the cut groove. The suction unit is attached to the body unit using an adhesive.