SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT CHIP

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing the increase of a period of time needed for dicing even when the number of wiring layers increases, and to provide a method of manufacturing the semiconductor integrated circuit chip.

SOLUTION: Chip areas 22 and 23, and a scribing area 21 provided between the chip areas 22 and 23 are provided. Then the scribing area 21 includes metal films 11 and 12 differing in distance from a surface of a semiconductor substrate 1, and the metal films 11 and 12 shift in position in a direction parallel to the surface of the semiconductor substrate 1.

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