发明名称 PRINTED-CIRCUIT BOARD WITH EMBEDDED PATTERN, AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-circuit board and a structure embedded in the inside of a circuit insulating layer to prevent undercut and provide a fine circuit. <P>SOLUTION: The printed-circuit board includes a first insulating layer 300, a second insulating layer 500 formed on the first insulating layer 300 and having an opening part for forming a circuit layer, and a circuit layer 900 comprising a conductive metal filled in the opening part. A composition surface is formed between the first insulating layer 300 and the second insulating layer 500. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010129997(A) 申请公布日期 2010.06.10
申请号 JP20090049575 申请日期 2009.03.03
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK SE WON
分类号 H01R12/51;H05K3/10;H05K3/46 主分类号 H01R12/51
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