发明名称 |
PRINTED-CIRCUIT BOARD WITH EMBEDDED PATTERN, AND ITS MANUFACTURING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-circuit board and a structure embedded in the inside of a circuit insulating layer to prevent undercut and provide a fine circuit. <P>SOLUTION: The printed-circuit board includes a first insulating layer 300, a second insulating layer 500 formed on the first insulating layer 300 and having an opening part for forming a circuit layer, and a circuit layer 900 comprising a conductive metal filled in the opening part. A composition surface is formed between the first insulating layer 300 and the second insulating layer 500. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010129997(A) |
申请公布日期 |
2010.06.10 |
申请号 |
JP20090049575 |
申请日期 |
2009.03.03 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK SE WON |
分类号 |
H01R12/51;H05K3/10;H05K3/46 |
主分类号 |
H01R12/51 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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