| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip laminated body that has a good package reliability (a HAST-resistant property) even under a high-temperature and high-humidity condition since the amount of ion impurities included in an adhesive agent composition after hardening that configures an adhesive agent layer is small. <P>SOLUTION: A semiconductor chip laminated body is configured by laminating a plurality of semiconductor chips via an adhesive agent layer. The adhesive agent layer is configured by an adhesive agent composition containing an acrylic polymer (A), an epoxy resin (B), a thermal hardening agent (C), and a specific organic phosphine system compound as a thermal hardening promoter (D). The containing amount of the organic phosphine system compound (D) is 0.001 to 15 pts.wt. with the total 100 pts.wt. of the epoxy resin (B) and the thermal hardening agent (C). <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
