| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition excellent in adhesion, thickness accuracy, height evenness and burying property for level difference, and to provide a semiconductor device excellent in evenness and mechanical strength, made in the resin composition. SOLUTION: The resin composition includes: (A) a cyclic olefin polymer or its hydrogenated polymer; and (B) a compound having a structure of general formula (1). The semiconductor device made using the resin composition is also disclosed. COPYRIGHT: (C)2010,JPO&INPIT
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