OPTO-ELECTRONIC SEMICONDUCTOR MODULE AND METHOD FOR THE PRODUCTION THEREOF

摘要

An opto-electronic semiconductor module is provided, comprising a chip carrier (9), a light-emitting semiconductor chip (10) mounted on the chip carrier, and a cover element (5) with an at least partially transparent cover plate (300) that is arranged on the side of the semiconductor chip facing away from the chip carrier and that has a frame part (100). Said frame part laterally surrounds the semiconductor chip, is connected to the cover plate without a joining layer and connected to the chip carrier on the side of the frame part lying furthest away from the cover plate. Furthermore, a method for producing an opto-electronic semiconductor module is provided.