MANUFACTURING METHOD OF BOC PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method of a BOC printed circuit board is provided to prevent the inferiority of a metal burr and increase the number of stack-up. CONSTITUTION: A circuit pattern including a plurality of solder ball pads and bonding finger are formed on a copper clad laminate. A solder resist is formed on the surface of the copper clad laminate. A gold plated layer is formed on a part of the circuit pattern. An oval-shaped slot is formed in the center of the copper clad laminate.