| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly cool a power semiconductor module. <P>SOLUTION: The power semiconductor module includes a segmented base plate 35 and at least two circuit carriers 30. The base plate 35 includes at least two base plate segments 35a, 35b spaced apart from one another. Each of the circuit carriers 30 includes a ceramic substrate 31 provided with at least an upper side metal layer (a first metal layer) 32. Each of the circuit carriers 30 is arranged on each of the substrate segments 35a, 35b. At least two of the circuit carriers are spaced apart from one another. <P>COPYRIGHT: (C)2010,JPO&INPIT |
