| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: an optical semiconductor device having an optical semiconductor element arranged in an airtight space, heat dissipation efficiency for heat generation of the optical semiconductor element being good during use; and a method of manufacturing the optical semiconductor device which has good production efficiency without causing a negative effect on element characteristics of the optical semiconductor element and reliability of the optical semiconductor device during the manufacture. <P>SOLUTION: A sealed body 13 is constituted by connecting external electrode terminals 2 to both ends of a cylindrical body portion 1 made of translucent ceramic, and the optical semiconductor element 8 is mounted on a sub-mount 7 fitted with a pair of metal leads 9; and an electrode of the optical semiconductor element 8 and one side ends of the metal leads 9 are connected together through a bonding wire 10, and a metal disks 4 are connected to other side ends of the metal leads 9 to constitute an optical semiconductor element module 12. The optical semiconductor element module 12 is inserted into the sealing body 13 and an inert gas 14 is charged to be airtightly sealed with the external electrode terminals 2 and the metal disk 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
