发明名称 LAMINATED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a laminated wiring board, wherein conductive parts of respective wiring boards are electrically connected with each other between a plurality of laminated wiring boards without providing through-holes. SOLUTION: The laminated wiring board 10 includes a first wiring board 20 having a first base material 21 and a first conductive part 23 provided on one side 21a of the first base material 21, a third conductive part 25 provided on the other side 21b of the first base material 21, and a second wiring board 30 having a second base material 31 and a second conductive part 32 provided on one side 31a of the second base material 31. The second wiring board 30 is disposed along one side face of the first wiring board 20, and the first conductive part 23 is connected to the third conductive part 25 through the second conductive part 32. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010129851(A) 申请公布日期 2010.06.10
申请号 JP20080304308 申请日期 2008.11.28
申请人 TOPPAN FORMS CO LTD 发明人 KAWAZOME MITSURU
分类号 H05K1/11;H05K3/40 主分类号 H05K1/11
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