发明名称 |
METHOD OF PRODUCING EXTERNAL PADS ON A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE |
摘要 |
External electrical connection pads are provided on a semiconductor device. A well is formed in an outer surface for the semiconductor device to at least partially expose an internal electrical connection pad. An electrical connection tab is formed which has an internal branch extending over the internal pad, an external branch extending over a top of the outer surface and extending from one side edge of the well, and a linking branch extending over a sidewall of the wells between the external branch and the internal branch.
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申请公布号 |
US2010140774(A1) |
申请公布日期 |
2010.06.10 |
申请号 |
US20090629785 |
申请日期 |
2009.12.02 |
申请人 |
STMICROELECTRONICS S.A. |
发明人 |
PRUVOST SEBASTIEN;CHABERT LAURENT |
分类号 |
H01L25/065;H01L21/768;H01L23/488;H01L23/52 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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