发明名称 DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a deposition method, capable of selectively heating a deposition material by using a powder deposition material mainly for instance and thus quickly and efficiently performing deposition processing. SOLUTION: The method of forming a thin film on the surface of a workpiece W includes: a depositing step for depositing the deposition material on the surface of the workpiece and forming a deposition material layer 70; and an irradiation step of forming the thin film 72A by irradiating the workpiece where the deposition material layer is formed with electromagnetic waves 74 and heating the deposition material layer. Thus, the deposition material is selectively heated by using the powder deposition material mainly for instance and the deposition processing is quickly and efficiently performed. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010129790(A) 申请公布日期 2010.06.10
申请号 JP20080303171 申请日期 2008.11.27
申请人 TOKYO ELECTRON LTD 发明人 SHIMIZU MASAHIRO
分类号 H01L21/288;H01L21/283;H01L21/316 主分类号 H01L21/288
代理机构 代理人
主权项
地址