| 摘要 |
PROBLEM TO BE SOLVED: To easily mount a high-precision semiconductor laser in a short time. SOLUTION: First, a semiconductor laser bar forming a plurality of semiconductor laser chips and a first electrode having an insulating layer on one surface are each fixed on a fixation table having a vacuum hole with the insulating layer of the first electrode facing the fixation table by sucking air from the vacuum hole in a predetermined relative positional relationship. The first electrode and the semiconductor laser bar are bonded to each other by a connection material of a conductive material, and the semiconductor laser chips are separated from the semiconductor laser bar by using impact applied in the bonding. Thereafter, the semiconductor laser chips are fixed to a second electrode, and the insulating layer of the first electrode is stuck to the second electrode. COPYRIGHT: (C)2010,JPO&INPIT |
