发明名称 Plattiertes Element und Verfahren zum Herstellen desselben
摘要 <p>According to the present invention, in order to suppress whisker formation on a plated member having a plated layer comprising a lead-free material, the orientation index of the plane (321) in a plated layer for a plated member 3 having a plated layer 2 comprising a lead-free material on the surface of a base material 1 is 2.5 to 4.0. In another embodiment, the value (220)/(321) derived from the ratio of the orientation index of the plane (220) to that of the plane (321) for the plated layer is 0.5 to 1.5. An undercoat layer 4 having the orientation plane (220) may be formed between the base material 1 and the plated layer 2.</p>
申请公布号 DE112008001094(T5) 申请公布日期 2010.06.10
申请号 DE20081101094T 申请日期 2008.04.18
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 NOMURA, TAKASHI;SHIBATA, YASUHUMI;KONDA, SHIGERU;SAKANO, MITSURU
分类号 C23C30/00;C25D5/34;C25D7/00 主分类号 C23C30/00
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