摘要 |
An electrical connector system for mounting a substrate comprises a plurality of wafer assemblies. Each of the wafer assemblies comprises a center frame (208), a first array of electrical contacts (210), a second array of electrical contacts (212), and a plurality of ground shields. The center frame (208) defines a first side (218) and a second side (220) opposing the first side, wherein the first and second sides each define a plurality of electrical contact channels. At least one of the first and second sides defines a plurality of ground shield channels (224) that are positioned on the wafer assembly (206) such that each ground shield channel is separated from another ground shield channel by an electrical contact channel of the plurality of electrical contact channels (222). The first array of electrical contacts (210) is positioned within the plurality of electrical contact channels (222) of the first side (218), the second array of electrical contacts (212) is positioned within the plurality of electrical contact channels (226) of the second side (220), and the plurality of ground shields is positioned within the plurality of ground shield channels (224). |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
DEFIBAUGH, GEORGE RICHARD;FEDDER, JAMES LEE;FOWLER, DAVID KEAY;GLOVER, DOUGLAS WADE;HELSTER, DAVID WAYNE;KNAUB, JOHN EDWARD;MINNICK, TIMOTHY ROBERT;MORGAN, CHAD WILLIAMS;O'DONNELL, PETER C.;SHARF, ALEX MICHAEL;SIPE, LYNN ROBERT;WICKES, EVAN CHARLES;WOOD, DONALD EVERETT |