| 摘要 |
A reflow furnace is provided in which a cleaning/cooling apparatus of exhaust gas is installed, so that even an indoor working environment is not affected, wherein clean exhaust having been cleaned and cooled is circulated in the furnace, so that a stable soldering process and efficient operation of the apparatus are achieved. A reflow furnace includes conveyance means for conveying a board having solder paste attached thereon, a heating furnace applying heat to the board passing therethrough by the conveyance means, an inlet port for sucking hot gas generated in the heating furnace, and a cooling apparatus for cleaning and cooling the sucked hot gas. A cooling zone 9 is arranged at a downstream side of the heating furnace in a conveyance line of the board, and a clean exhaust cooled by the cooling apparatus is circulated in a cooling zone.
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