| 摘要 |
PROBLEM TO BE SOLVED: To confirm the accuracy of plating area for wire bonding visually and easily. SOLUTION: The non-lead type resin sealed semiconductor device comprises a semiconductor element 4 mounted on a die pad 3, wires 6 for connecting the electrodes on the upper surface of the semiconductor element 4 electrically with the terminal parts 5 of a lead frame 1, and a sealing resin 7 sealing the surrounding region of the semiconductor element 4 including the wires 6 under a state where the lower surface and the side face of the terminal parts 5 are exposed wherein a groove 8 for defining the silver plating area for wire connection is made in the terminal parts 5 of the lead frame 1. Since the accuracy of plating area can be confirmed visually and easily, inspection cost can be suppressed. |
