发明名称 |
METHOD FOR BONDING SEMICONDUCTOR WAFERS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
In a method for bonding semiconductor wafers of the present invention, a bonding layer containing a flux-active curing agent and a thermosetting resin is interposed between a first semiconductor wafer and a second semiconductor wafer, thereby producing a semiconductor wafer stacked body in which the first and second semiconductor wafers are stacked together, and then the semiconductor wafer stacked body is compressed in a thickness direction thereof while heating it so that the first and second semiconductor wafers are fixed together by melting and solidifying solder bumps while curing the thermosetting resin, thereby producing a semiconductor wafer bonded body in which first connector portions and second connector portions are electrically connected together through solidified products obtained by melting and solidifying the solder bumps. |
申请公布号 |
EP2144282(A4) |
申请公布日期 |
2010.06.09 |
申请号 |
EP20080752033 |
申请日期 |
2008.04.24 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
MAEJIMA, KENZOU;KATSURAYAMA, SATORU;SUGINO, MITSUO |
分类号 |
H01L21/60;H01L21/02;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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