发明名称 Method and device for cooling computer components which generate heat
摘要 <p>The arrangement has cooling bodies (40, 50) arranged in a direction of a provided cooling air flow (30) in a plane (10). The cooling bodies comprise a set of regions (41, 42, 51, 52) with different heat transfer characteristics, where the regions lie opposite to each other. The cooling bodies are rotated or displaced in the plane in such a manner that one of the regions with poor heat transfer characteristics of one of the bodies is downstream to two of the regions of the set of regions of the bodies in the direction of the cooling air flow.</p>
申请公布号 EP2194440(A2) 申请公布日期 2010.06.09
申请号 EP20090172687 申请日期 2009.10.09
申请人 SINITEC VERTRIEBSGESELLSCHAFT MBH 发明人 RIEBEL, MICHAEL
分类号 G06F1/20;H01L23/467;H05H7/20 主分类号 G06F1/20
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