PVD coating with switchable bias voltage

摘要

The physical vapor deposition (PVD) coating method comprises galvanically coupling a voltage source (10) for applying a bias voltage during igniting a discharge on a substrate (2) automatically from the substrate, where high power impulse magnetron sputtering is used in connection with a negative bias voltage on the substrate. The voltage source is connected during abating the discharge again with the substrate and coupled to the substrate, when the total bias voltage drops under a value of 200 V and when a current with a current strength of greater than 10A flows on the substrate. The physical vapor deposition (PVD) coating method comprises galvanically coupling a voltage source (10) for applying a bias voltage during igniting a discharge on a substrate (2) automatically from the substrate, where high power impulse magnetron sputtering is used in connection with a negative bias voltage on the substrate. The voltage source is connected during abating the discharge again with the substrate and coupled to the substrate, when the total bias voltage drops under a value of 200 V and when a current with a current strength of greater than 10A flows on the substrate. The voltage source of the substrate is coupled when the electric powder of a discharge on the substrate exceeds a threshold value of 50-200 KW. An independent claim is included for a device for PVD coating of a substrate.