| 摘要 |
Problem To provide a removal method of wax capable of uniformly removing the wax adhering to a wafer surface and reducing the problems of re-adhesion of particles and filter clogging of a cleaning bath during cleaning. Means for solving the problem A cleaning method of a semiconductor wafer of removing wax, which is adhering to a wafer surface, by using cleaning liquid, the cleaning method is characterized in that the cleaning liquid contains microbubbles.
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