发明名称 Multilayer chip capacitor
摘要 A multilayer chip capacitor including: a capacitor body having a plurality of dielectric layers deposited therein and having a parallelepiped shape; at least three pairs of first and second external electrodes formed on two longer sides, the first and second external electrodes in each of the pairs having different polarities and opposing each other, and the first and second external electrodes on each of the longer sides arranged alternately with each other; and a plurality of first and second internal electrodes arranged alternately to interpose each of the dielectric layers, the first and second internal electrodes connected to the first and second external electrodes by leads, respectively, wherein the capacitor body has a length that is 2.5 times greater than a width thereof.
申请公布号 US7733628(B2) 申请公布日期 2010.06.08
申请号 US20070005300 申请日期 2007.12.27
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/228;H01G4/06 主分类号 H01G4/228
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