发明名称 Heat sink assembly for a pluggable module
摘要 A heat sink assembly includes a base frame and a heat sink having a module engagement surface configured to be in thermal communication with an engagement surface of a pluggable module. The heat sink assembly also includes transfer links extending between the heat sink and the base frame. The transfer links are movable to transfer the heat sink with respect to the base frame. The heat sink is movable between a recessed position and an elevated position, wherein the transfer links maintain the heat sink in a predetermined orientation with respect to the engagement surface of the pluggable module as the heat sink is transferred, between the recessed position and the elevated position.
申请公布号 US7733652(B2) 申请公布日期 2010.06.08
申请号 US20080212305 申请日期 2008.09.17
申请人 TYCO ELECTRONICS CORPORATION 发明人 COSTELLO BRIAN PATRICK;COLE JORDAN MARSHALL
分类号 H05K7/20;F28F7/00;H01L23/34 主分类号 H05K7/20
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