发明名称 Method of manufacturing semiconductor element
摘要 A method of manufacturing a semiconductor device includes a process of forming a gate electrode having a metallic silicide layer on a semiconductor substrate, a process of decreasing boundaries of grains on the surface of the metallic silicide layer, at least a portion of which is exposed, and a process of forming spacers comprising an oxide film on the side wall of the gate electrode; in this order. Thus, abnormal oxidation of the metallic silicide layer is avoided.
申请公布号 US7732272(B2) 申请公布日期 2010.06.08
申请号 US20030677221 申请日期 2003.10.03
申请人 OKI SEMICONDUCTOR CO., LTD. 发明人 OHSAKO TAKASHI;MORI HIROTAKA;YOSHIDA KATSUJI
分类号 H01L21/28;H01L21/8238;H01L21/3205;H01L21/336;H01L21/4763;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/28
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