发明名称 Wiring board and method for manufacturing the same
摘要 A wiring board includes: a semiconductor chip; an insulating layer in which the semiconductor chip is embedded; a wiring connected to the semiconductor chip; and reinforcing layers for reinforcing the insulating layer, the reinforcing layers respectively formed on a front face side of the insulating layer and a rear face side of the insulating layer.
申请公布号 US7732712(B2) 申请公布日期 2010.06.08
申请号 US20060421607 申请日期 2006.06.01
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 YAMANO TAKAHARU
分类号 H05K1/16 主分类号 H05K1/16
代理机构 代理人
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