| 摘要 |
A solid-state imaging device is provided and includes: a semiconductor substrate; a plurality of photoelectric conversion elements arranged in a two-dimensional array, each of the photoelectric conversion elements accumulating a signal charge in accordance with a received amount of light; a charge transfer path that transfers the signal charge read out from the photoelectric conversion elements; two branch transfer paths, each receiving the signal charge transferred through the charge transfer path and transferring the signal charge to an output end of the solid-state imaging device; a charge branching part in a connecting portion between the charge transfer path and the two branch transfer paths, the charge branching part distributing the signal charge toward one of the two branch transfer paths, and a unit that treats signals corresponding to branching residual charges in the charge branching part so that the signals are distributed in a checkerboard pattern on a reproduced image.
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