发明名称 |
Semiconductor device, relay chip, and method for producing relay chip |
摘要 |
A semiconductor device including a circuit substrate including n number of terminals; a semiconductor chip provided on the circuit substrate and including n number of terminals; and a relay chip including a triangular substrate having a first side, a second side and a third side which form triangle, n number of first terminals located along the first side, n number of second terminals located along the second side, and a plurality of wires connecting the first terminals and the second terminals respectively; a first wire connecting each of the n number of terminals of the circuit substrate to a corresponding first terminal among the n number of first terminals; and a second wire connecting each of the n number of terminals of the semiconductor chip to a corresponding second terminal among the n number of second terminals.
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申请公布号 |
US7732930(B2) |
申请公布日期 |
2010.06.08 |
申请号 |
US20070851118 |
申请日期 |
2007.09.06 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MAKINO EIICHI;OHSHIMA SHIGEO;OKUMURA NAOHISA |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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