SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME

摘要

PURPOSE: A substrate polishing apparatus and a substrate polishing method using the same are provided to improve a polishing uniformity and a polishing efficiency by controlling a polishing quantity of the substrate according to a horizontal position of a polishing pad. CONSTITUTION: The substrate is settled on a substrate support member(100). A polishing unit(300) includes a polishing pad(1000) with polishing an upper side of the substrate. A controller(60) controls the substrate support member and the polishing unit in a polishing process. The controller controls a polishing quantity of the substrate according to a horizontal position of the polishing pad. The controller controls the substrate with separating to a plurality of adjustment sections.