SUBSTRATE POLISHING APPARATUS AND METHOD OF POLISHING SUBSTRATE USING THE SAME

摘要

PURPOSE: A substrate polishing device and a substrate polishing method using the same are provided to polish minute sections by polishing a substrate with polishing pads with different sizes. CONSTITUTION: A substrate polishing device includes a substrate support member, a polishing unit, and a polishing pad. A plurality of polishing units is arranged on the upper side of the substrate received in the substrate supporting member and includes a plurality of polishing pads which polishes the substrate. The polishing pads of the polishing unit have different sizes. The wafer are received in FOUPs(Front Open Unified Pods)(12a) on load ports(11a).