PRINTED CIRCUIT BOARD HAVING SIDE CONTACT HOLE PAD AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent a second external insulation layer from sliding down inside a lateral contact hole by stacking a bonding sheet on the lateral contact hole. CONSTITUTION: A first internal circuit layer(106a) and a second internal circuit layer(108a) are formed on both sides of an internal insulation layer(102). A first external insulation layer and a first external circuit layer are successively formed on the first internal circuit layer. A bonding sheet, a second external insulation layer, and a second external circuit layer are successively formed on the second internal circuit layer. A lateral contact hole(114) passes through the internal insulation layer and the first external insulation layer. A lateral contact hole pad(116) is formed on the lateral contact hole to electrically connect the first external circuit layer, the first internal circuit layer, and the second internal circuit layer.