A PRINTED CIRCUIT BOARD AND A FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve matching between a solder ball and a solder pad by burying the solder pad on an insulation layer. CONSTITUTION: A printed circuit board(100a) comprises an insulation layer(102), a solder pad(104) and a solder resist layer(110). The solder pad is buried in the insulation layer to have the same height as the surface of the insulation layer. A plurality of grooves is formed on the solder pad to increase an adhesive area between the solder ball and the solder pad. The solder resist layer is formed on the insulation layer. An open unit is formed on the solder resist layer to expose the solder pad.