PACKAGING METHOD FOR LIGHT EMITTING DIODE DEVICE

摘要

PURPOSE: A packaging method of a light emitting diode(LED) is provided to simplify a packaging operation by pressurizing and heating a reflector and a printed circuit board which include an adhesive sheet in between. CONSTITUTION: A reflector is manufactured through an injection molding method(S1). An adhesive sheet of a plate shape forming a plurality of holes is manufactured by press punching(S2). A printed circuit board is welded(S3) by pressurizing and heating the printed circuit board and the reflector. An LED is mounted on the printed circuit board which has passed the reflector attachment stage. The LED is separated with a cutting laser(S4).