MANUFACTURING METHOD OF WAFER

摘要

PURPOSE: A wafer manufacturing method according to the present invention is provided to gain the wafer of a high quality by eliminating defect which exists on an initial wafer. CONSTITUTION: A wafer is washed(S100). The safer is planarized(S200). A thin film layer is formed on the wafer surface(S300). The wafer surface including the thin film layer is texture-processed(S400). The wafer surface is processed with a hydrogen plasma(S500).