发明名称 |
NEW ANTIOXIDANTS FOR POST-CMP CLEANING FORMULATIONS |
摘要 |
<p>An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.</p> |
申请公布号 |
KR20100059744(A) |
申请公布日期 |
2010.06.04 |
申请号 |
KR20097026414 |
申请日期 |
2008.05.16 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS INC. |
发明人 |
ZHANG PENG;BARNES JEFFREY;SONTHALIA PRERNA;COOPER EMANUEL;BOGGS KARL |
分类号 |
C11D3/30;C09K13/00;C11D1/62 |
主分类号 |
C11D3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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