发明名称 MANUFACTURING METHOD OF POLYSILICON-INSULATOR-POLYSILICON CAPACITOR FOR SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE: A method for manufacturing a polysilicon-insulator-polysilicon(PIP) capacitor is provided to increase the contact area of an upper and a lower polysilicon layers in order to obtain the desire capacitance of the capacitor by forming the lower polysilicon layer in a pyramid shape. CONSTITUTION: An insulating layer(20) is formed on a semiconductor substrate(10). A polysilicon layer(300) which functions as a lower conductive layer is deposited on the insulating layer. A stepped layer is formed on the polysilicon layer by performing a partial-etching operation. An etching process is performed in order to form a photo resist pattern including the stepped layer. A dielectric layer(400) is deposited. The polysilicon layer which functions as an upper conductive layer(500) is deposited.</p>
申请公布号 KR20100059276(A) 申请公布日期 2010.06.04
申请号 KR20080117985 申请日期 2008.11.26
申请人 DONGBU HITEK CO., LTD. 发明人 KANG, DONG WOO
分类号 H01L27/108;H01L21/027 主分类号 H01L27/108
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