LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to express the cover of the light emitting diode package with desired color by additionally coating the filler of desired color on the top of molding material. CONSTITUTION: A pair of lead frames(110) is prepared. A package mold(120) comprises the molding material filling space. An LED chip(130) is mounted on the lead frame inside the package. A filler(160) is spread in the molding material filling space of the molding material top. The molding material includes the light-passing resin or the transparent resin mixed with the fluorescent substance(155).