| 摘要 |
PURPOSE: A dicing die-bonding film and a method for manufacturing a semiconductor device are provided to smoothly perform a dicing process by securely maintaining an object like a semiconductor wafer. CONSTITUTION: An adhesive layer of a dicing film is made of a thermal expansible adhesive including an acrylic polymer A and a foaming agent. The acrylic polymer A includes an acrylic acid ester of 50 weight% or more marked as CH2= CHCOOR, a monomer including a hydroxyl group of 1 weight% to 30 weight% and the monomer composition without the monomer containing a carboxylic group. A thermal expansible adhesive layer(1b) has a surface free energy less than 30mJ/m^2. A die-bonding film(3) is made of a resin composition including an epoxy resin. |
