发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 PURPOSE: A light emitting device package is provided to improve reliability for the light emitting device package by improving yield rate of color coordinate and effectively implementing radiation of light emitting device package. CONSTITUTION: A package body(110) comprises a first cavity and a second cavity(115). A first lead electrode is formed on the second cavity. A second lead electrode is formed on the first cavity. A light emitting device chip(130) is electrically connected to the first lead electrode and the second lead electrode. A fluorescent material layer(140) is included in at least one of the first cavity domain and the second cavity domain.
申请公布号 KR20100058978(A) 申请公布日期 2010.06.04
申请号 KR20080117579 申请日期 2008.11.25
申请人 LG INNOTEK CO., LTD. 发明人 KIM, WAN HO;PARK, JUN SEOK
分类号 H01L33/62 主分类号 H01L33/62
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