DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A dicing die-bonding film and a method for manufacturing a semiconductor device are provided to improve a balance property of a low pollution by bonding the die-bonding film with a semiconductor chip. CONSTITUTION: A dicing film(2) has an adhesive layer installed on a base material. A die-bonding film is installed on the adhesive layer. The adhesive layer of the dicing film has a laminating structure in which a thermal expansible adhesive layer(1b1) containing the foaming agent and an active energy ray curable antifouling adhesive layer(1b2) are successively laminated on the base material. The die-bonding film is made of a resin composition including an epoxy resin.