发明名称 COMMUNICATION MODULE OF SYSTEM IN PACKAGE STRUCTURE HAVING ANTENNA
摘要 PURPOSE: A communication module of SIP(System In Package) structure mounted with an antenna for blocking an electromagnetic wave is provided to minimize the communication module by forming an antenna on a low temperature heating. CONSTITUTION: A low temperature cofired ceramic cap(130) is formed on a substrate(100). The low temperature cofired ceramic cap blocks the electronic wave by covering the communication devices. An antenna(140) is formed on the low temperature cofired ceramic cap. The low temperature cofired ceramic cap comprises laminated first and second dielectrics. A ground is formed between the first and second dielectrics.
申请公布号 KR20100059053(A) 申请公布日期 2010.06.04
申请号 KR20080117692 申请日期 2008.11.25
申请人 LG INNOTEK CO., LTD. 发明人 CHO, YOUNG BIN
分类号 H01L23/58 主分类号 H01L23/58
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